At 40% by volume SiC, RAV40's a zero-sacrifice solution for today's Power Electronic designs. Achieving top thermal conductivity, RAV40 exhibits:
a 25% reduction in CTE versus Copper
a 65% weight reduction versus Copper
a 250% increase in specific stiffness versus Copper (NVH)
significant cost reduction compared to Preform AlSiC
mass production for hundreds of thousands or millions per year quantities
Other applications include CTE-matched housings for printed circuit boards or thermal assemblies as well as a ballistic material in multi-layer armor designs, providing exceptional stiffness at a light weight.
