Solder joint reliability has become the chief concern of electronic packaging. Thermal conductivity is important, but Coefficient of Thermal Expansion (CTE) is what will determine the lifetime of your device. Ravelin Materials' wide range of products allows you to select the solution that is right for your application. For reducing cost, select RAV20 to replace copper with the same CTE but 70% weight reduction or for performance, select RAV55 to replace expensive preform infiltrated Al-SiC. Otherwise, RAV30 and RAV40 could be the right balance of price and performance you are looking for.
